SCOPUS 정보 검색 플랫폼

Volumn 44, Issue 2, 2004, Pages 259-267

Sub-pixel image correlation: An alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

(5) Goh, Jason Y L a Pitter, Mark C a See, Chung W a Somekh, Michael G a Vanderstraeten, Daniel b

a UNIVERSITY OF NOTTINGHAM (United Kingdom)

b ON SEMICONDUCTOR (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; CRACKS; DEFORMATION; DYES; ERROR ANALYSIS; FOURIER TRANSFORMS; INTERFEROMETRY; INTERPOLATION; MICROSCOPIC EXAMINATION; PACKAGING; SEMICONDUCTOR MATERIALS; SENSORS; STRESSES;

CRACK DETECTION; IMAGE CORRELATION; SCANNING ACOUSTIC MICROSCOPY (SAM); SEMICONDUCTOR PACKAGES;

MICROELECTRONICS;

EID: 0942266462 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(03)00162-8 Document Type: Article

Times cited : (9)

References (9)

1
- 0028532084
- Electronic speckle photography - Increased accuracy by nonintegral pixel shifting
- Sjodahl M. Electronic speckle photography - increased accuracy by nonintegral pixel shifting. Appl. Opt. 33:1994;6667-6673.
- (1994) Appl. Opt. , vol.33 , pp. 6667-6673
- Sjodahl, M.¹

2
- 0008799530
- Accuracy in electronic speckle photography
- Sjodahl M. Accuracy in electronic speckle photography. Appl. Opt. 36:1997;2875-2885.
- (1997) Appl. Opt. , vol.36 , pp. 2875-2885
- Sjodahl, M.¹

3
- 0032419716
- Recent advances of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronic devices
- Han B. Recent advances of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronic devices. Exp. Mech. 38:1998;278-288.
- (1998) Exp. Mech. , vol.38 , pp. 278-288
- Han, B.¹

4
- 0030241715
- Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy
- Yang J. Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy. Microelectron. Reliab. 36:1996;1291-1295.
- (1996) Microelectron. Reliab. , vol.36 , pp. 1291-1295
- Yang, J.¹

5
- 0030288653
- MicroDAC - A novel approach to measure in situ deformation fields of microscopic scale
- Vogel D., Schubert A., Faust W., Dudek R., Michel B. MicroDAC - A novel approach to measure in situ deformation fields of microscopic scale. Microelectron. Reliab. 36:1996;1939-1942.
- (1996) Microelectron. Reliab. , vol.36 , pp. 1939-1942
- Vogel, D.¹ Schubert, A.² Faust, W.³ Dudek, R.⁴ Michel, B.⁵

6
- 0038925218
- Subpixel microscopic deformation analysis using correlation and artificial neural networks
- Pitter M.C., See C.W., Somekh M.G. Subpixel microscopic deformation analysis using correlation and artificial neural networks. Opt. Express. 8:2001;322-327.
- (2001) Opt. Express. , vol.8 , pp. 322-327
- Pitter, M.C.¹ See, C.W.² Somekh, M.G.³

7
- 0942280648
- Focus errors and their correction in microscopic deformation analysis using correlation
- Pitter M.C., See C.W., Goh J.Y.L., Somekh M.G. Focus errors and their correction in microscopic deformation analysis using correlation. Opt. Express. 10:2001;1361-1367.
- (2001) Opt. Express. , vol.10 , pp. 1361-1367
- Pitter, M.C.¹ See, C.W.² Goh, J.Y.L.³ Somekh, M.G.⁴

8
- 0004080484
- McGraw-Hill
- Goodman J.W. Introduction to Fourier optics. 1996;McGraw-Hill.
- (1996) Introduction to Fourier Optics
- Goodman, J.W.¹

9
- 0003416238
- New York: Wiley
- Pilkey W.D. Formulas for stress, strain, and structural matrices. 1994;Wiley, New York.
- (1994) Formulas for Stress, Strain, and Structural Matrices
- Pilkey, W.D.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.