Resistance of through-thickness grain boundaries to cleavage cracking in silicon thin films

Scripta Materialia

Volumn 59, Issue 2, 2008, Pages 251-254

  Qiao, Yu ^a   Chen, Jin ^a  

^a UNIVERSITY OF CALIFORNIA SAN DIEGO   (United States)

Author keywords

Fracture; Grain boundaries; Thin films; Toughness

Indexed keywords

CRACK INITIATION; FILM THICKNESS; FRACTURE; GRAIN BOUNDARIES; POLYSILICON;

CLEAVAGE CRACKING; SILICON THIN FILMS;

THIN FILMS;

EID: 43449134343     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.03.022     Document Type: Article

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