Secondary cracking at grain boundaries in silicon thin films

Scripta Materialia

Volumn 57, Issue 12, 2007, Pages 1069-1072

  Chen, Jin ^a   Qiao, Yu ^a  

^a UNIVERSITY OF CALIFORNIA SAN DIEGO   (United States)

Author keywords

Fracture; Grain boundaries; Semiconductors; Thin films

Indexed keywords

CRACK INITIATION; GRAIN BOUNDARIES; POLYSILICON;

CRACK PATH CURVES; FREE STANDING POLYSILICON THIN FILMS; IRREGULAR CLEAVAGE FRONT TRANSMISSION; SILICON THIN FILMS;

THIN FILMS;

EID: 34548825408     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.08.037     Document Type: Article

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