Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich

Journal of Materials Research

Volumn 23, Issue 4, 2008, Pages 1087-1094

  Kuo, Shih Ming ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTROMIGRATION; GROWTH RATE; NUCLEATION; ZINC;

CURRENT STRESSING; POLARITY EFFECT;

INTERMETALLICS;

EID: 42949090800     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0142     Document Type: Article

References (21)

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