Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 471-477

  Salam, B ^a   Ekere, N N ^a   Rajkumar, D ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MICROSTRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL CYCLING; TIN ALLOYS;

LEAD-FREE SOLDER; SOLDERABILITY; TIN SILVER COPPER ALLOY;

SOLDERING ALLOYS;

EID: 0034829029     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Lead-free solders: Technology
2. Are you ready for lead-free solder paste?
3. An analysis of the current status of lead-free soldering - Update 2000
4. Lead free solder: The Sn/Ag/Cu system
5. A scientific guide to surface mount technology
6. Role of intermetallic compounds in lead-free soldering
7. The mechanics of solder alloy interconnects
8. 3 solder joints
9. Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly
10. Ageing effects on shear fatigue life of solder joint between Pd/Ag conductor and Sn/Pb/Ag solder
11. Evaluation of intermetallic phase formation and concurrent dissolution of intermetallic during reflow soldering
12. Solder mechanics