An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

Materials Research Bulletin

Volumn 38, Issue 4, 2003, Pages 637-646

  Murali, S ^a   Srikanth, N ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

Diffusion; Intermetallic compounds; Microstructure; Semiconductors

Indexed keywords

ALUMINA; DIFFUSION; ELECTRIC WIRE; GOLD; MICROSTRUCTURE;

THERMAL AGING;

INTERMETALLICS;

EID: 0037463993     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0025-5408(03)00004-7     Document Type: Article

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