Adhesional bonding of fine gold wires to metal substrates

Journal of Adhesion Science and Technology

Volumn 17, Issue 3, 2003, Pages 435-451

  Takahashi, Yasuo ^a   Matsusaka, Souta ^b  

^a OSAKA UNIVERSITY   (Japan)

^b CHIBA UNIVERSITY   (Japan)

Author keywords

Adhesion; Adhesional contact; Argon ion irradiation; Elastic contact; Elasto plastic contact; Fine wire; Gold; Surface energy

Indexed keywords

BOND STRENGTH (MATERIALS); ELASTICITY; ELASTOPLASTICITY; FRACTURE TOUGHNESS; GOLD; INTERFACIAL ENERGY; NUMERICAL ANALYSIS; SUBSTRATES; WIRE; ADHESION; SURFACE CHEMISTRY;

ADHESIONAL CONTACT; ARGON ION IRRADIATION; ELASTO-PLASTIC CONTACT; FINE GOLD WIRE; METAL SUBSTRATES;

ADHESION; WIRE;

APPLIED FORCES; ARGON ION IRRADIATION; CONTACT WIDTH; CYLINDRICAL BODIES; ELASTIC CONTACT; ELASTOPLASTIC CONTACT; GOLD WIRE; HOLDING TIME; METAL SUBSTRATE; SI SUBSTRATES; SMOOTH TRANSITIONS; SURFACE ENERGIES;

EID: 0037256987     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103762864723     Document Type: Article

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