Degradation of the Au 4Al compound in gold ballbonds during isothermal aging in air at 175°C

Journal of Materials Science

Volumn 39, Issue 19, 2004, Pages 6125-6128

  Breach, C D ^a   Tok, C W ^a   Wulff, F ^a   Calpito, D ^a  

^a Kulicke and Soffa SEA Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD BALLBONDS; HIGH STRENGTH BALL LIFTS (HSBL); ISOTHERMAL AGING; WIRE-BONDING PACKAGES;

AGING OF MATERIALS; ALLOYING; CRACK PROPAGATION; DEGRADATION; DOPING (ADDITIVES); ELECTRONICS PACKAGING; GROWTH (MATERIALS); HIGH TEMPERATURE EFFECTS; INTERMETALLICS; METALLIZING; OXIDATION; PLASTIC DEFORMATION; SHEAR STRENGTH; SOLDERING; SOLID SOLUTIONS; SURFACE STRUCTURE;

GOLD COMPOUNDS;

EID: 4544286796     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000041716.58658.0a     Document Type: Article

References (11)

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