An unusual mechanical failure mode in gold ballbonds at 50 μm pitch due to degradation at the Au-Au4Al interface during ageing in air at 175 °c

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 543-557

  Breach, C D ^a   Wulff, F ^a   Tok, C W ^a  

^a Kulicke and Soffa SEA Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DEBONDING; GOLD; INTERMETALLICS; LOADS (FORCES); OXIDATION; PHASE TRANSITIONS;

BAKE TEST; HIGH STRENGTH BALL LIGHT; NECK BREAKS;

FAILURE (MECHANICAL);

EID: 30944442281     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.019     Document Type: Article

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