Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 367-374

  Kim, Hyoung Joon ^a   Lee, Joo Yeon ^b   Paik, Kyung Wook ^a   Koh, Kwang Won ^c   Won, Jinhee ^c   Choe, Sihyun ^c   Lee, Jin ^d   Moon, Jung Tak ^d   Park, Yong Jin ^d  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Packaging Engineering   (South Korea)

^d MK Electron   (South Korea)

Author keywords

Aluminum pad; Annealing; Ball shear tests; Bondability; Copper wire; Cu Al; Diffusion rate; IMC; Micro XRD

Indexed keywords

ALUMINUM; ANNEALING; COPPER; INTERFACES (MATERIALS); WIRE;

ALUMINUM PAD BONDABILITY; COPPER WIRE; DIFFUSION RATE;

BONDING;

EID: 0042386689     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815121     Document Type: Article

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