Solid-state reaction in an Au wire connection with an Al-Cu pad during aging

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 323-332

  Jang, Guh Yaw ^a   Duh, Jenq Gong ^a   Takahashi, Hideyuki ^b   Su, David ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b JEOL LTD   (Japan)

^c TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Al Cu pad; Au wire; Intermetallic compound; Ion milling; Phase transformations; Wire bonding

Indexed keywords

AU WIRE; ION MILLING; WIRE BONDING;

AGING OF MATERIALS; COATING TECHNIQUES; COPPER; ELECTRONICS PACKAGING; ETCHING; GOLD; INTEGRATED CIRCUITS; INTERMETALLICS; PHASE TRANSITIONS;

SOLID STATE PHYSICS;

EID: 33644918299     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692453     Document Type: Conference Paper

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