Interfacial thermal stresses in solder joints of leadless chip resistors

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 873-884

  Ghorbani, H R ^a   Spelt, J K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL EQUATIONS; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; SHEAR STRESS; SOLDERED JOINTS; STRENGTH OF MATERIALS; THERMAL STRESS;

ELEMENTARY STRENGTH; INTERFACIAL THERMAL STRESSES; LEADLESS CHIP RESISTOR (LCR);

RESISTORS;

EID: 33645166373     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.022     Document Type: Conference Paper

References (18)

1. Clech JP. Solder reliability solutions: A PC-based design-for-reliability tool. In: Surface mount international proceedings, San Jose, CA, US, September 8-12, 1996. p. 136-51.
2. Ghorbani HR, Spelt JK. Interfacial thermal stresses in trilayer assemblies. Trans ASME J Electron Pack, in press.
3. P.M. Hall Forces, moments and displacements during thermal chamber cycling of leadless ceramic chip carriers soldered to printed boards on components, hybrids and manufacturing technology IEEE Trans 7 4 1984 314 327
4. E. Jih, and Y.H. Pao Evaluation of design parameters for leadless chip resistors solder joints Trans ASME J Electron Pack 117 1995 94 99
5. E. Nicewarner Historical failure distribution and significant factors affecting surface mount solder joint fatigue life Solder Surf Mount Technol 17 1994 22 29
6. Y.H. Pao, and E. Eisele Interfacial shear and peel stresses in multilayered thin stacks subjected to uniform thermal loading Trans ASME J Electron Pack 113 1991 164 172
7. Qi Y, Ghorbani HR, Spelt JK. Accelerated thermal cycling of tin-lead and lead-free solder joints. In: SMTA international annual conference, Chicago, IL, USA, 2003. p. 735-40.
8. C.Q. Ru Interfacial thermal stresses in bimaterial elastic beams: modified beam models revisited Trans ASME J Electron Pack 124 2002 141 146
9. Suhir E. Calculated thermally induced stresses in adhesively bonded and soldered assemblies. In: International symposium on microelectronics proceedings, Atlanta, GA, October 1986. p. 383-92.
10. E. Suhir An approximate analysis of stresses in multilayered elastic thin films J Appl Mech 55 1988 143 148
11. E. Suhir Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends J Appl Phys 89 1 2001 120 129
12. E. Suhir Analysis of interfacial thermal stresses in a trimaterial assembly J Appl Phys 89 7 2001 3685 3694
13. E. Suhir Bimaterial assembly with a low modulus bonding later at the ends J Appl Phys 93 6 2003 3657 3661
14. S.P. Timoshenko, and J.N. Goodier Theory of elasticity 1970 McGraw-Hill New York
15. R.R. Tummala, and E.J. Rymaszewski Microelectronics packaging handbook 1997 Van Nostrand Reinhold New York
16. B. Vandevelde, F. Christiaens, E. Beyne, J. Roggen, J. Peeters, and K. Allaert Thermomechanical models for leadless solder interconnections in flip chip assemblies IEEE Trans Comp Pack Manuf Tech Part A 21 1 1998 177 185
17. Compaq Visual Fortran 6.6, Compaq Computer Corporation, Houston, Texas, USA, 2000.
18. ANSYS 8.0, ANSYS Inc., Canonsburg, Pennsylvania, USA, 2003.