Fiber alignment shift formation mechanisms of fiber-solder-ferrule joints in laser module packaging

Journal of Lightwave Technology

Volumn 19, Issue 8, 2001, Pages 1177-1184

  Cheng, Wood Hi ^a,b,c   Sheen, Maw Tyan ^c   Wang, Gow Ling ^c   Wang, Szu Chun ^d   Kuang, Jao Hwa ^c  

^a IEEE   (Taiwan)

^b OSA ^*  (Taiwan)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^d CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

Creep deformation; Fiber alignment shift; Finite element method; Laser module packaging; Residual stress

Indexed keywords

CREEP DEFORMATION; FIBER ALIGNMENT SHIFT FORMATION; FIBER-SOLDER-FERRULE JOINTS; LASER MODULE PACKAGING; RESIDUAL STRESS;

FINITE ELEMENT METHOD; LASER BEAM WELDING; OPTICAL FIBERS; OPTICAL VARIABLES MEASUREMENT; THERMAL EFFECTS;

OPTICAL TESTING;

EID: 0035416973     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/50.939799     Document Type: Article

References (26)

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