An investigation of nanoindentation creep in polycrystalline Cu thin film

Materials Letters

Volumn 58, Issue 19, 2004, Pages 2345-2349

  Wang, Fei ^a   Xu, Kewei ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Creep; Nanoindentation; Strain burst; Stress exponent

Indexed keywords

ALCOHOLS; COPPER; CREEP; DEFORMATION; GRAIN SIZE AND SHAPE; INDENTATION; MAGNETRON SPUTTERING; NUCLEATION; PLASMA HEATING; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY;

DEPTH SENSING; NANOINDENTATION; STRAIN BURST; STRESS EXPONENT;

THIN FILMS;

EID: 2942541608     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.02.043     Document Type: Article

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