Strain rate dependent behavior of pure aluminum and copper micro-wires

Materials Research Society Symposium - Proceedings

Volumn 695, Issue , 2002, Pages 159-164

  El Deiry, P A ^a   Vinci, R P ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; DISLOCATIONS (CRYSTALS); ELASTIC MODULI; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL VARIABLES MEASUREMENT; RELAXATION PROCESSES; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; TENSILE TESTING;

ANELASTICITY; DISLOCATION DENSITY; MICRO-WIRES; MICROTENSILE TESTS;

WIRE;

EID: 0036350007     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Tensile testing of free-standing Cu, Ag, and Al thin films and Ag/Cu multilayers
2. Monotonic and cyclic testing of thin film materials for MEMS applications
3. Anelastic effects in freestanding Al thin films
4. Annealing mechanisms of commercially pure aluminum alloy wires
5. Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications