The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Soldering & Surface Mount Technology

Volumn 17, Issue 3, 2005, Pages 3-8

  Huang, Meng Kuang ^a   Lee, Chiapyng ^a   Wu, Pei Lin ^a   Tzan, Shyh Rong ^b  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Fatigue; Reliability management; Soldering; Strength of materials; Surface properties of materials

Indexed keywords

CHIP SCALE PACKAGES; FATIGUE OF MATERIALS; FINISHING; LEAD COMPOUNDS; RELIABILITY; STRENGTH OF MATERIALS; SURFACE PROPERTIES; THERMAL CYCLING; TIN COMPOUNDS;

POWER DISSIPATION; RELIABILITY MANAGEMENT; SURFACE FINISH; SURFACE PROPERTIES OF MATERIALS;

SOLDERED JOINTS;

EID: 22544465002     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510613501     Document Type: Article

References (11)

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