Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag

Soldering & Surface Mount Technology

Volumn 19, Issue 3, 2007, Pages 3-8

  Jin Kim, M ^a   Zhou, Y Norman ^b   Pil Jung, Jae ^a  

^a University of Seoul   (South Korea)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Bonding; Reliability management; Solder; Soldering

Indexed keywords

CAPACITORS; ELECTROLESS PLATING; ELECTROPLATING; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; TIN COMPOUNDS;

NORMAL REFLOW TEMPERATURES; RELIABILITY MANAGEMENT; SOLDERING TEMPERATURE; SURFACE COATING;

SOLDERING;

EID: 36749063075     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910710843711     Document Type: Article

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