Interconnections based on Bi-coated SnAg solder balls

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 515-520

  Korhonen, Tia Marje ^a   Vuorinen, Vesa ^b   Kivilahti, Jorma K ^b  

^a School of Operations Research and Industrial Engineering   (United States)

^b AALTO UNIVERSITY   (Finland)

Author keywords

AgSn solder; Bismuth coating; Bismuth precipitates; Lead free solders; Low bonding temperature; Thermodynamic modeling; Transient liquid phase bonding

Indexed keywords

HIGH MELTING POINT SOLDERS; LEAD FREE SOLDERS; THERMODYNAMIC EQUILIBRIUM; TIN SILVER ALLOY;

BISMUTH; COATINGS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLIDIFICATION; SUBSTRATES; TEMPERATURE; THERMODYNAMIC PROPERTIES; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 0035521196     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982838     Document Type: Article

References (14)

1. Rapid formation of intermetallic compounds by interdiffusion in the Cu-Sn and Ni-Sn systems
2. Development of transient liquid phase sintered (TLPS) Sn-Bi solder pastes
3. A diffusional model for transient liquid phase bonding
4. A new bonding technology using gold and tin multilayer composite structures
5. Electrical properties of solder filled anisotropically conductive adhesives
6. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder
7. Deformation behavior of dilute SnBi (0.5 to 6 at. pct) solid solutions
8. A thermodynamic evaluation of the Ag-Sn system
9. A thermodynamic study of the phase equilibria in the Bi-Sn-Sb system
10. Thermodynamic assessments of the Sn-In and Sn-Bi binary systems
11. On the Sn-Bi-Ag ternary phase diagram
12. The local nominal composition-a useful concept for microjoining and interconnection applications