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Materials Transactions

Volumn 45, Issue 3, 2004, Pages 783-789

Microstructure and strength of Sn-Bi coated Sn-3.5 mass% Ag solder alloy

(4) Lee, Jaesik a Bang, Woongho b Jung, Jaepil a Oh, Kyuhwan b

a University of Seoul (South Korea)

b Seoul National University (South Korea)

Author keywords

Coated solder; Joint strength; Lead free solder; Microstructure; Tin bismath

Indexed keywords

COATINGS; ELECTRIC CURRENTS; ELECTROPLATING; ETHANOL; INTERMETALLICS; LOW TEMPERATURE OPERATIONS; MELTING; MICROSTRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERED JOINTS; TIN ALLOYS; TIN COMPOUNDS; WETTING;

COATED SOLDER; JOINT STRENGTH; LEAD-FREE SOLDER; TIN-BISMUTH;

SOLDERING ALLOYS;

EID: 2442575858 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.783 Document Type: Article

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.