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Volumn 283, Issue 1-2, 2000, Pages 38-45

Development of transient liquid phase sintered (TLPS) Sn-Bi solider pastes

Author keywords

Eutectic composition; Sn and Bi powder mixures; Thermal analysis

Indexed keywords

ADHESIVE PASTES; BISMUTH; COMPOSITION; EUTECTICS; HEATING; METAL MELTING; MIXTURES; RAPID SOLIDIFICATION; SINTERING; THERMAL EFFECTS; THERMOANALYSIS; TIN;

EID: 0033904421     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)00621-3     Document Type: Article
Times cited : (40)

References (12)
  • 2
    • 0342780808 scopus 로고
    • Powder Metallurgy
    • in: E. Klar, A. Mills (Eds.), ASM, Metals Park, Ohio
    • Powder Metallurgy, in: E. Klar, A. Mills (Eds.), ASM Metals Handbook, vol. 7, ASM, Metals Park, Ohio, 1984, pp. 316-321.
    • (1984) ASM Metals Handbook , vol.7 , pp. 316-321
  • 11
    • 85162600622 scopus 로고    scopus 로고
    • TLPS solder and brazing pastes, U.S. Provisional Patent Application, February 2000
    • S.F. Corbin, X. Qiao, B. Reyburn, J. McIsaac, TLPS solder and brazing pastes, U.S. Provisional Patent Application, February 2000.
    • Corbin, S.F.1    Qiao, X.2    Reyburn, B.3    McIsaac, J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.