Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

International Journal of Solids and Structures

Volumn 45, Issue 3-4, 2008, Pages 921-942

  Ogurtani, Tarik Omer ^a   Akyildiz, Oncu ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Cathode drift; Computer simulations; Electromigration; Grain boundary grooving; Models of non equilibrium phenomena; Surface diffusion; Surface morphology

Indexed keywords

COMPUTER SIMULATION; COPPER; ELECTROMIGRATION; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; SURFACE DIFFUSION; SURFACE MORPHOLOGY; THIN FILMS;

CATHODE DRIFT; MODELS OF NON-EQUILIBRIUM PHENOMENA; SURFACE DRIFT-DIFFUSION;

GRAIN BOUNDARIES;

EID: 36048946398     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2007.09.007     Document Type: Article

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