Effects of capillary forces on copper/dielectric interfacial void evolution

Applied Physics Letters

Volumn 84, Issue 25, 2004, Pages 5201-5203

  Choy, Jun Ho ^a   Kavanagh, Karen L ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; CAPILLARITY; CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTROMIGRATION; FINITE DIFFERENCE METHOD; FREE ENERGY; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALLIZING;

BOLTZMANN CONSTANT; CAPILLARY FORCES; DIFFUSION BARRIERS; ELECTRON WIND FORCES;

COPPER;

EID: 3142688203     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1764942     Document Type: Article

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