Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures

Journal of Applied Physics

Volumn 96, Issue 12, 2004, Pages 7246-7253

  Ogurtani, Tarik Omer ^a   Oren, Ersin Emre ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY VALUE PROBLEMS; CONTAMINATION; COPPER; DATA REDUCTION; ELECTROMIGRATION; OPTICAL INTERCONNECTS;

COPPER INTERCONNECTS; GRAIN-BOUNDARY INTERACTIONS; MEAN TIME TO FAILURE (MTTF); NEAR-BAMBOO STRUCTURE;

GRAIN BOUNDARIES;

EID: 11044234550     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1815389     Document Type: Article

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