Role of plasticity on interface crack initiation from a free edge and propagation in a nano-component

International Journal of Fracture

Volumn 145, Issue 4, 2007, Pages 261-271

  Hirakata, Hiroyuki ^a,b   Takahashi, Yoshimasa ^a   Truong, Do ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Copper; Crack; Crack initiation; Crack propagation; Delamination; Interface; Interface edge; Nano component; Plasticity; Silicon; Thin film

Indexed keywords

COPPER; CRACK PROPAGATION; DELAMINATION; ELASTOPLASTICITY; INTERFACES (MATERIALS); SILICON; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

INTERFACE EDGE; NANO-CANTILEVER BEND METHOD; NANO-COMPONENT;

CRACK INITIATION;

EID: 35748953100     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-007-9079-0     Document Type: Article

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