Direct measurement of interface strength between copper submicron-dot and silicon dioxide substrate

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 47, Issue 3, 2004, Pages 324-330

  Hirakata, Hiroyuki ^a   Kitamura, Takayuki ^a   Yamamoto, Yoshitake ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Atomic force microscopy; Delamination; Interface strenght; Material testing; Micro material; Micromechanics; Submicron dot

Indexed keywords

ATOMIC FORCE MICROSCOPY; DEFORMATION; DUCTILITY; SILICA; SUBSTRATES;

INTERFACE STRENGTH; LATERAL DISPLACEMENT; STRESS FIELDS;

INTERFACES (MATERIALS);

INTERFACIAL TENSION;

EID: 4744375354     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.47.324     Document Type: Article

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