Evaluation of interface strength between thin films fabricated on a silicon substrate for an advanced LSI on the basis of fracture mechanics concept

Materials Science Forum

Volumn 426-432, Issue 4, 2003, Pages 3469-3474

  Shibutani, Tadahiro ^a   Tsuruga, Tetsu ^a   Yu, Qiang ^a   Shiratori, Masaki ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

Finite Element Analysis; Fracture Mechanics; Interface Strength; LSI conductor; Silicon substrate; Stress Intensity; Thin Films

Indexed keywords

FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); LSI CIRCUITS; SHEAR STRESS; SILICON; STRESS INTENSITY FACTORS;

INTERFACE STRENGTH;

THIN FILMS;

EID: 0037999812     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.3469     Document Type: Conference Paper

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