Effect of residual stress on delamination from interface edge between nano-films

Engineering Fracture Mechanics

Volumn 70, Issue 15, 2003, Pages 2089-2101

  Kitamura, Takayuki ^a   Hirakata, Hiroyuki ^a   Itsuji, Takashi ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Delamination; Fracture mechanics; Interface edge; Interface strength; Nano film; Residual stress; Stress singularity; Thin film

Indexed keywords

CRACK INITIATION; DELAMINATION; RESIDUAL STRESSES; STRESS INTENSITY FACTORS; THIN FILMS;

FREE EDGE EFFECT;

FRACTURE MECHANICS;

DELAMINATION;

EID: 0041841214     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(02)00254-0     Document Type: Article

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