Fatigue crack growth along interface between metal and ceramics submicron-thick films in inert environment

Acta Materialia

Volumn 54, Issue 1, 2006, Pages 89-97

  Hirakata, Hiroyuki ^a   Kitazawa, Masaya ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Crack growth; Fatigue; Interfaces; Thin films

Indexed keywords

ATMOSPHERIC HUMIDITY; CERAMIC MATERIALS; COPPER; CRACK PROPAGATION; CYCLIC LOADS; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); SILICON NITRIDE; STRESS INTENSITY FACTORS;

FATIGUE CRACK GROWTH; FOUR-POINT BEND SPECIMEN; INTERFACE CRACKS; SUBCRITICAL CRACK GROWTH;

THICK FILMS;

EID: 27744601756     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.08.026     Document Type: Article

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