Application of bimaterial interface corner failure mechanics to silicon/glass anodic bonds

Journal of the Mechanics and Physics of Solids

Volumn 50, Issue 3, 2002, Pages 405-433

  Labossiere, Paul E W ^a   Dunn, Martin L ^b   Cunningham, Shawn J ^c  

^a University of Washington   (United States)

^b UCB 450   (United States)

^c European Headquarter and Development Center   (United States)

Author keywords

A. Stress intensity factor; Crack initiation; Failure mechanism; Interface corner

Indexed keywords

CHEMICAL BONDS; CRACK INITIATION; CRACK PROPAGATION; FAILURE (MECHANICAL); GLASS; SILICON; STRESS ANALYSIS;

ANODIC BONDS; BIMATERIAL INTERFACES;

INTERFACES (MATERIALS);

EID: 0036495385     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(01)00087-4     Document Type: Article

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