Effect of loading frequency on fatigue crack growth between a submicron-thick film and a substrate

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 49, Issue 3, 2006, Pages 370-375

  Van Truong, Do ^a   Hirakata, Hiroyuki ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Crack propagation; Fatigue; Fracture mechanics; Interface; Thin film

Indexed keywords

ATMOSPHERIC HUMIDITY; COPPER; ENVIRONMENTAL IMPACT; FATIGUE CRACK PROPAGATION; INTERFACES (MATERIALS); SILICON; STRESS INTENSITY FACTORS; SUBSTRATES; THICK FILMS;

CRACK GROWTH RATE; INTERFACE CRACK; SUBMICRON-THICK FILM;

FRACTURE MECHANICS;

ATMOSPHERIC HUMIDITY; COPPER; ENVIRONMENTAL IMPACT; FATIGUE CRACK PROPAGATION; FRACTURE MECHANICS; INTERFACES (MATERIALS); SILICON; STRESS INTENSITY FACTORS; SUBSTRATES; THICK FILMS;

EID: 33847258729     PISSN: 13447912     EISSN: 13475363     Source Type: Journal    
DOI: 10.1299/jsmea.49.370     Document Type: Article

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