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Volumn 27, Issue 1, 2004, Pages 182-190

Package to board interconnection shear strength (PBISS): Effect of surface finish, PWB build-up layer and chip scale package structure

Author keywords

Aramid; Black pad; Portable electronics; PWB quality; Solder joint quality

Indexed keywords

FRACTURE; INTERCONNECTION NETWORKS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; SHEAR STRENGTH; SOLDERED JOINTS; STIFFNESS; SURFACE MOUNT TECHNOLOGY;

EID: 2442451195     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.825785     Document Type: Article
Times cited : (20)

References (12)
  • 3
    • 84960356461 scopus 로고    scopus 로고
    • Intermetallic formation in the Ag-Sn solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength
    • M. Shin, Y. Kim, W. Do, S. Ha, and B. Min, "Intermetallic formation in the Ag-Sn solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength," in Proc. Int. Symp. Electron. Mater. Packag., 2001, pp. 155-162.
    • Proc. Int. Symp. Electron. Mater. Packag., 2001 , pp. 155-162
    • Shin, M.1    Kim, Y.2    Do, W.3    Ha, S.4    Min, B.5
  • 6
    • 0035454958 scopus 로고    scopus 로고
    • Electroelss Ni/immersion Au interconnects: Investigation of black pad in wire bonds and solder joints
    • P. Snugovsky, P. Arrowsmith, and M. Romansky, "Electroelss Ni/immersion Au interconnects: investigation of black pad in wire bonds and solder joints," J. Electron. Mater., vol. 30, no. 9, pp. 1262-1270, 2001.
    • (2001) J. Electron. Mater. , vol.30 , Issue.9 , pp. 1262-1270
    • Snugovsky, P.1    Arrowsmith, P.2    Romansky, M.3
  • 9
    • 0018442538 scopus 로고
    • Low expansivity organic substrate for flip-chip bonding
    • Mar.
    • S. E. Greer, "Low expansivity organic substrate for flip-chip bonding," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 2, pp. 140-144, Mar. 1979.
    • (1979) IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol.2 , pp. 140-144
    • Greer, S.E.1
  • 11
    • 85009042106 scopus 로고    scopus 로고
    • Experimental validation of the impact of thermal expansion of printed circuit boards on solder joint reliability
    • D. Rose and B. Hunter, "Experimental validation of the impact of thermal expansion of printed circuit boards on solder joint reliability," in Proc. Surface Mount Technol. Assoc. Int. Symp., 2000.
    • Proc. Surface Mount Technol. Assoc. Int. Symp., 2000
    • Rose, D.1    Hunter, B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.