Transient simulation of solder joint fracturing under impact test

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 689-694

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD;

IMPACT LOAD; TRANSIENT DEFORMATION;

SOLDERED JOINTS;

EID: 28444484336     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. nd Electr. Comp. Technol. Conf., 2002, pp. 1256-1262.
2. rd Electr. Comp. Technol. Conf., 2003, pp. 64-70.
3. st Electr. Comp. Technol. Conf., 2001, pp. 1065-1071.
4. Date, M. et al, "Ductile-to-brittle Transition in Sn-Zn Solder Joints Measured by Impact Test,"Scripta Materialia Vo. 51 (2004), pp. 641-645.
5. Yeh, C.-L. et al, "Transient Deformation and Fracturing of Solder Joints Subjected to Impact Loads,"Proc Flip Chip 2004, 2004.
6. ANSYS Inc., ANSYS v.7.0 Manuals, 2002.
7. Belytschko, T. and Lin, J.-I., "A Three-dimensional Impact-penetration Algorithm with Erosion,"Computers & Structures Vol. 25, No. 1 (1987), pp. 95-104.