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Journal of Electronic Materials

Volumn 23, Issue 8, 1994, Pages 765-772

Microstructure evolution of eutectic Sn-Ag solder joints

(3) Yang, Wenge a Messler, Robert W a Felton, Lawrence E a

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

Author keywords

Intermetallics; laser soldering; lead free solder

Indexed keywords

EID: 51249164221 PISSN: 03615235 EISSN: 1543186X Source Type: Journal
DOI: 10.1007/BF02651371 Document Type: Article

Times cited : (282)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.