A bonding technique using hydrophilic SU-8

Journal of Micromechanics and Microengineering

Volumn 17, Issue 10, 2007, Pages 1978-1984

  Chen, Yu Tzu ^a   Lee, Denz ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; HYDROPHILICITY; MICROFLUIDICS; PLASMA THEORY; PRESSURIZATION; SURFACE ACTIVE AGENTS;

BONDING CAPABILITY; HYDROPHILIC SURFACES; PLASMA TREATMENT; PRESSURIZING EQUIPMENTS;

SURFACE STRUCTURE;

EID: 34748922500     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/10/008     Document Type: Article

References (17)

1. Xiao Z X, Wu G Y, Li Z H, Zhang G B, Hao Y L and Wang Y Y 1999 Silicon-glass wafer bonding with silicon hydrophilic fusion bonding technology Sensors Actuators A 72 46-8
2. Quenzer H J, Dell C and Wagner B 1996 Silicon-silicon anodic-bonding with intermediate glass layers using spin-on glasses IEEE Proc. MEMS (San Diego, CA) pp 272-6
3. Jiao J, Lu D, Xiong B and Wang W 1995 Low-temperature silicon direct bonding and interface behaviours Sensors Actuators A 50 117-20
4. Pang C T, Yang H, Shen S C, Chou M C and Chou H P 2002 A low-temperature wafer bonding technique using patternable materials J. Micromech. Microeng. 12 611-5
5. Jackman R J, Floyd T M, Ghodssi R, Schmidt M A and Jensen K F 2001 Microfluidic systems with on-line UV detection fabricated in photodefinable epoxy J. Micromech. Microeng. 11 263-9
6. Carlier J, Arscott S, Thomy V, Fourrier J C, Caron F, Camart J C, Druon C and Tabourier P 2004 Integrated microfluidics based on multi-layered SU-8 for mass spectrometry analysis J. Micromech. Microeng. 14 619-24
7. Agirregabiria M, Blanco F J, Berganzo J, Arroyo M T, Fullaondo A, Mayora K and Ruano-López J M 2005 Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps Lab Chip 5 545-52
8. L'Hostis E, Michel P E, Fiaccabrino G C, Strike D J, de Rooij N F and Koudelka-Hep M 2000 Microreactor and electrochemical detectors fabricated using Si and EPON SU-8 Sensors Actuators B 64 156-62
9. Nicklaus F, Enoksson P, Kälvesten E and Stemme G 2001 Low-temperature full wafer adhesive bonding J. Micromech. Microeng. 11 100-7
10. Oberhammer J, Niklaus F and Stemme G 2003 Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities Sensors Actuators A 105 297-304
11. Eaton W P, Risbud S H and Smith R L 1994 Silicon wafer-to-wafer bonding at T < 200 °C with polymethylmethacrylate Appl. Phys. Lett. 65 439-41
12. Lorenz H, Despont M, Fahrni N, LaBianca N, Renaud P and Vettiger P 1997 SU-8: a low-cost negative resist for MEMS J. Micromech. Microeng. 7 121-4
13. Tay F E H, van Kan J A, Watt F and Choong W O 2001 A novel micro-machining method for the fabrication of thick-film SU-8 embedded micro-channels J. Micromech. Microeng. 11 27-32
14. Alderman B E J, Mann C M, Steenson D P and Chamberlain J M 2001 Microfabrication of channels using an embedded mask in negative resist J. Micromech. Microeng. 11 703-5
15. Han A, Oh K W, Bhansali S, Henderson H T and Ahn C H 2000 A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems IEEE Proc. MEM (Miyazaki, Japan) pp 414-8
16. Frazier A B 1995 Low temperature IC-compatible wafer-to-wafer bonding with embedded micro channels for integrated sensing systems IEEE Proc. Midwest Symp. on Circuits and System (Rio de Janeiro, Brazil) pp 505-8
17. http://www.microchem.com/index.htm