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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 4 B, 2007, Pages 1955-1960

Analyses of interface adhesion between Cu and SiCN etch stop layers by nanoindentation and nanoscratch tests

(2) Chang, Shou Yi a Lee, Yu Shuien a

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

Adhesion; Bonding; Interconnect; Interface; Nanoindentation; Nanoscratch

Indexed keywords

BOND STRENGTH (MATERIALS); CHEMICAL BONDS; COPPER; ETCHING; NANOINDENTATION; SILICON COMPOUNDS;

ADHESION ENERGY; NANOSCRATCH; OXIDE LAYERS;

INTERFACES (MATERIALS);

EID: 34547867833 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.46.1955 Document Type: Article

Times cited : (7)

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