Adhesion quantification of post-CMP copper to amorphous SiN passivation by nanoindentation

Materials Research Society Symposium - Proceedings

Volumn 649, Issue , 2001, Pages

  Vella, J B ^a   Smith, S M ^a   Volinsky, A A ^a   Adhihetty, I S ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; BRITTLE FRACTURE; CHEMICAL MECHANICAL POLISHING; DELAMINATION; ELECTRODEPOSITION; INDENTATION; INTERFACES (MATERIALS); PASSIVATION; PLASMA APPLICATIONS; SILICON NITRIDE;

ADHESION QUANTIFICATION; BEND TESTING; CONICAL INDENTER; INTERFACIAL FRACTURE; NANOINDENTATION; PLASMA TREATMENTS;

COPPER;

EID: 0034874374     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)