Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects

Applied Physics Letters

Volumn 90, Issue 24, 2007, Pages

  Choi, Zung Sun ^a   Mönig, Reiner ^a   Thompson, Carl V ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; GRAIN SIZE AND SHAPE; METALLIZING; POLYCRYSTALLINE MATERIALS;

ELECTROMIGRATION DIFFUSIVITIES; IMMOBILE VOIDS; POLYCRYSTALLINE COPPER INTERCONNECTS; RELIABILITY PROJECTIONS;

ELECTROMIGRATION;

EID: 34250644430     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2742285     Document Type: Article

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