Kinetics of void drift in copper interconnects

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 363-368

  Choi, Zung Sun ^a   Mönig, Reiner ^a   Thompson, Carl V ^a   Burns, Michael ^b  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; COPPER; CRYSTALLOGRAPHY; DIFFRACTION; ELECTROMIGRATION; NUCLEATION; SCANNING ELECTRON MICROSCOPY;

COPPER INTERCONNECTS; ELECTRICAL FAILURE; VOID DRIFT; VOID NUCLEATION;

OPTICAL INTERCONNECTS;

EID: 33749600419     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f08-03     Document Type: Conference Paper

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