Microstructural influences on stress migration in electroplated Cu metallization

Applied Physics Letters

Volumn 83, Issue 10, 2003, Pages 1962-1964

  Sekiguchi, A ^a   Koike, J ^a   Maruyama, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; INTERFACES (MATERIALS); MICROSTRUCTURE; STRESSES; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY;

STRESS MIGRATION;

METALLIZING;

EID: 0141955131     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1609238     Document Type: Article

References (17)

1. P. Borgesen, J. K. Lee, R. Gleixner, and C. Y. Li, Appl. Phys. Lett. 60, 1706 (1992).
2. A. Sekiguohi, J. Koike, and K. Maruyama, Mater. Trans. 43, 1633 (2002).
3. J. A. Nucci, Y. Shacham-Diamond, and J. E. Sanchez, Jr., Appl. Phys. Lett. 66, 3585 (1995).
4. J. A. Nucci, R. R. Keller, J. E. Sanchez, Jr., and Y. Shacham-Diamond, Appl. Phys. Lett. 69, 4017 (1996).
5. R. R. Keller, J. A. Nucci, and D. P. Field, J. Electron. Mater. 26, 996 (1997).
6. P. Chaudhari, J. Appl. Phys. 45, 4339 (1974).
7. W. B. Pennebaker, J. Appl. Phys. 40, 394 (1969).
8. S. Vaidya and A. K. Sinha, Thin Solid Films 75, 253 (1981).
9. D. B. Knorr, D. B. Tracy, and K. P. Rodbell, Appl. Phys. Lett. 59,3241 (1991).
10. J. Koike, M. Wada, M. Sanada, and K. Maruyama, Appl. Phys. Lett. 81, 1017 (2002).
11. A. Sekiguchi, J. Koike, S. Kamiya, M. Saka, and K. Maruyama, Appl. Phys. Lett. 79, 1264 (2001).
12. E. M. Hofer and H. E. Hintermann, J. Electrochem. Soc. 112, 167 (1965).
13. S. V. Surnev and I. V. Tomov, J. Appl. Electrochem. 19, 752 (1989).
14. D. N. Lee, S. Kang, and J. Yang, Plat. Surf. Finish. 82, 76 (1995).
15. W. M. Kuschke, A. Kretschmann, R. M. Keller, R. P. Vinci, C. Kaufmann, and E. Arzt, J. Mater. Res. 13, 2962 (1998).
16. F. Ernst, M. W. Finnis, A. Koch, C. Schmidt, B. Straumal, and W. Gust, Z. Metallkd. 87, 911 (1996).
17. D. L. Medlin, G. H. Campbell, and C. B. Carter, Acta Mater. 46, 5135 (1998).