Textural and microstructural transformation of Cu damascene interconnects after annealing

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 506-514

  Cho, Jae Young ^a   Lee, Hyo Jong ^b   Kim, Hyoungbae ^a   Szpunar, Jerzy A ^a  

^a MCGILL UNIVERSITY   (Canada)

^b Seoul National University   (South Korea)

Author keywords

Cu damascene interconnects; Electron backscattered diffraction (EBSD); Grain boundary character distribution (GBCD); Microstructure; Stress; Texture

Indexed keywords

ANNEALING; COPPER; ELECTROLYTIC POLISHING; ELECTROMAGNETIC WAVE BACKSCATTERING; GRAIN BOUNDARIES; MICROSTRUCTURE; STRESS ANALYSIS; TEXTURES;

CU DAMASCENE INTERCONNECTS; ELECTRON BACKSCATTERED DIFFRACTION (EBSD); GRAIN BOUNDARY CHARACTER DISTRIBUTION (GBCD); MICROSTRUCTURAL TRANSFORMATIONS;

OPTICAL INTERCONNECTS;

EID: 20344386478     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0058-9     Document Type: Conference Paper

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