In situ transmission electron microscope observations of electromigration in copper lines at room temperature

Applied Physics Letters

Volumn 87, Issue 14, 2005, Pages 1-3

  Liao, C N ^a   Chen, K C ^a   Wu, W W ^a   Chen, L J ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRYSTALLINE MATERIALS; ELECTRIC CURRENTS; ELECTROMIGRATION; TRANSMISSION ELECTRON MICROSCOPY;

COPPER ATOMS; ELECTRIC CURRENT STRESSING; ROOM TEMPERATURE;

COPPER;

EID: 28344432636     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2081138     Document Type: Article

References (13)

1. C. K. Hu and J. E. Harper, Mater. Chem. Phys. 52, 5 (1998).
2. B. H. Jo and R. W. Vook, Thin Solid Films 262, 129 (1995).
3. D. Padhi and G. Dixit, J. Appl. Phys. 94, 6463 (2003).
4. M. Hayashi, S. Nakano, and T. Wada, Microelectron. Reliab. 43, 1545 (2003).
5. K. L. Lee, C. K. Hu, and K. N. Tu, J. Appl. Phys. 78, 4428 (1995).
6. E. liniger, L. Gignac, C. K. Hu, and S. Kaldor, J. Appl. Phys. 92, 1803 (2002).
7. T. G. Koetter, H. Wendrock, H. Schuehrer, C. Wenzel, and K. Wetzig, Microelectron. Reliab. 40, 1295 (2000).
8. K. N. Tu, J. Appl. Phys. 94, 5451 (2003).
9. C. L. Liu, J. M. Cohen, J. B. Adams, and A. F. Voter, Surf. Sci. 253, 334 (1991).
10. M. Karimi and T. Tomkowski, Phys. Rev. B 52, 5364 (1995).
11. A. Magnaterra, Phys. Lett. 44A, 63 (1973).
12. C. Rye, K. W. Kwon, A. L. S. Loke, H. Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Ray, and S. S. Wong, IEEE Trans. Electron Devices 46, 1113 (1999).
13. L. Vanasupa, Y. C. Joo, P. R. Besser, and S. Pramanick, J. Appl. Phys. 85, 2583 (1999).