Effect of N H3 on the low pressure chemical vapor deposition of Ti O2 film at low temperature using tetrakis(diethylamino)titanium and oxygen

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 25, Issue 2, 2007, Pages 360-367

  Song, Xuemei ^a   Takoudis, Christos G ^a,b  

^a University of Illinois at Chicago   (United States)

^b University of Illinois at Chicago   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GROWTH RATE; LOW PRESSURE CHEMICAL VAPOR DEPOSITION; OXYGEN; SECONDARY ION MASS SPECTROMETRY; THERMAL EFFECTS; TITANIUM;

REACTIVE PRECURSORS; TITANIUM TETRAISOPROPOXIDE;

TITANIUM DIOXIDE;

EID: 34248545803     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2699121     Document Type: Article

References (39)

1. A. Bittar, D. Cochrane, S. Caughley, and I. Vickeridge, J. Vac. Sci. Technol. A 15, 223 (1997).
2. C. Y. Ting, Thin Solid Films 119, 11 (1984).
3. Gang He, Qi Fang, Liqiang Zhu, Mao Liu, and Lide Zhang, Chem. Phys. Lett. 395, 259 (2004).
4. Never Kaliwoh, Jun-Ying Zhang, and Ian W. Royd, Appl. Surf. Sci. 186, 241 (2002).
5. H. K. Pulker, G. Paesold, and E. Ritter, Appl. Opt. 15, 2986 (1976).
6. K. S. Yeung and Y. W. Lam, Thin Solid Films 109, 169 (1983).
7. C. C. Fulton, G. Lucovsky, and R. J. Nemanich, J. Vac. Sci. Technol. B 20, 1726 (2002).
8. Feng Zhang, Xiang Wang, Changrong Li, Huimin Wang, Lizhi Chen, and Xianghui Liu, Surf. Coat. Technol. 110, 136 (1998).
9. Sung-Hoon Jung and Sang-Won Kang, Jpn. J. Appl. Phys., Part 1 40, 3147 (2001).
10. S. S. Huang and J. S. Chen, J. Mater. Sci.: Mater. Electron. V13, 77 (2002).
11. Seong Keun Kim, Wan-Don Kim, Kyung-Min Kim, Cheol Seong Hwang, and Jaehack Jeong, Appl. Phys. Lett. 85, 4112 (2004).
12. J. W. Klaus and S. M. George, Surf. Sci. 447, 81 (2000).
13. G. K. Dalapati, S. Chatterjee, S. K. Samanta, and C. K. Maiti, Appl. Surf. Sci. 210, 249 (2003).
14. Jaime B. Woods, David B. Beach, Cara L. Nygren, and Zi-Ling Xue, Chem. Vap. Deposition 11, 289 (2005).
15. L. Niinistö, M. Nieminen, J. Päiväsaari, J. Niinistö, M. Putkonen, and M. Nieminen, Phys. Status Solidi A 201, 1443 (2004).
16. Yoshihide Senzaki, Seung Park, Hood Chatham, Lawrence Bartholomew, and Wesley Nieveen, J. Vac. Sci. Technol. A 22, 1175 (2004).
17. K. A. Son, et al., J. Vac. Sci. Technol. A 16, 1670 (1998).
18. Yoshizumi Ishikawa, Hideyasu Honda, and Yoshiyuki Sugahara, J. Sol-Gel Sci. Technol. 19, 365 (2000).
19. Zhenjiang Cui, Jonathan M. Madsen, and Christos G. Takoudis, J. Appl. Phys. 87, 8181 (2000).
20. Kyoung-Ho Ahn, Young-Bae Park, and Dong-Wha Park, Surf. Coat. Technol. 171, 198 (2003).
21. J. P. Endle, Y. M. Sun, J. Silverman, N. Nguyen, A. H. Cowley, J. M. White, and J. G. Ekerdt, Thin Solid Films 385, 66 (2001).
22. Hyuk Kyoo Jang and Chan Lim, U.S. Patent No. 883581 (18 June 2001).
23. J. Tong, N. Magtoto, and J. Kelber, Appl. Surf. Sci. 220, 203 (2003).
24. Renaud M. Fix, Roy G. Gordon, and David M. Hoffman, Chem. Mater. 2, 235 (1990).
25. Lawrence H. Dubois, Polyhedron 13, 1329 (1994).
26. H. C. Man, Z. D. Cui, and X. J. Yang, Appl. Surf. Sci. 199, 293 (2002).
27. M. Balaceanu, M. Brai, D. Macovei, M. J. Genet, A. Manea, D. Pantelica, V. Braic, and F. Negoita, J. Optoelectron. Adv. Mater. 4, 107 (2002).
28. F. Esaka, et al., J. Vac. Sci. Technol. A 15, 2521 (1997).
29. Fu-Hsing Lu and Hong-Ying Chen, Surf. Coat. Technol. 130, 290 (2000).
30. Xingbin Yan, Tao Xu, Gang Chen, Shengrong Yang, Huiwen Liu, and Qunji Xue, J. Phys. D 37, 907 (2004).
31. J. S. Corneile, P. J. Chen, C. M. Truong, W. S. Oh, and D. W. Goodman, J. Vac. Sci. Technol. A 13, 1116 (1995).
32. S. J. Xiao, M. Textor, N. D. Spencer, and H. Sigrist, Langmuir 14, 5507 (1998).
33. A. Hoffman, R. Brener, I. Gouzman, C. Cytermann, H. Geller, L. Levin, and M. Kenny, Diamond Relat. Mater. 4, 292 (1995).
34. Naresh C. Saha and Harland G. Tompkins, J. Appl. Phys. 72, 3072 (1992).
35. Xuemei Song and Christos G. Takoudis, Paper 206e, 2005 AlChE Annual Conference, Cincinnati, OH, Oct. 30-Nov. 4, 2005.
36. Ming-Kwei Lee, Jung-Jie Huang, and Tsung-Shun Wu, Semicond. Sci. Technol. 20, 519 (2005).
37. S. H. Mohamed, O. Kappertz, T. Niemeier, R. Drese, M. M. Wakkad, and M. Wuttig, Thin Solid Films 468, 48 (2004).
38. Anthony J. Toprac, Shi-Qing Wang, Joshua Musher, and Roy G. Gordon, Mater. Res. Soc. Symp. Proc. 355, 323 (1995).
39. Do-Heyoung Kim, Gyeong Taek Lim, Su-Kyung Kim, Jin Won Park, and Jae-Gab Lee, J. Vac. Sci. Technol. B 17, 2197 (1999).