Real-time sensing and metrology for atomic layer deposition processes and manufacturing

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 1, 2007, Pages 130-139

  Henn Lecordier, Laurent ^e   Lei, Wei ^b   Anderle, Mariano ^c   Rubloff, Gary W ^a,d  

^a UNIVERSITY OF MARYLAND   (United States)

^b Novellus Systems   (United States)

^c ITC IRST   (Italy)

^d Institute for Research and Applied Physics   (United States)

^e NONE

Author keywords

[No Author keywords available]

Indexed keywords

CYCLE NUMBER; REAL-TIME SENSING; WAFER EFFECT;

CHEMICAL REACTORS; FILM THICKNESS; GROWTH KINETICS; MASS SPECTROMETRY; NUCLEATION; SURFACE PROPERTIES;

ATOMIC LAYER DEPOSITION;

EID: 34047169417     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2429672     Document Type: Article

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