Lead-free chip scale packages: Assembly and drop test reliability

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 1, 2006, Pages 1-9

  Liu, Yueli ^a   Tian, Guoyun ^a   Gale, Shyam ^a   Johnson, R Wayne ^a   Crane, Lawrence ^b  

^a AUBURN UNIVERSITY   (United States)

^b Henkel Loctite Corp   (United States)

Author keywords

Chip scale packaging (CSP); Drop test reliability; Lead free; Underfill

Indexed keywords

EUTECTICS; FAILURE ANALYSIS; FLUXES; SOLDERING; SOLDERING ALLOYS;

CAPILLARY UNDERFILL; CORNER BOND UNDERFILL; DROP TEST RELIABILITY; FLUXING UNDERFILL; LEAD-FREE SOLDER ASSEMBLY;

CHIP SCALE PACKAGES;

EID: 32144435744     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.857679     Document Type: Article

References (10)

1. H. Peng, R. W. Johnson, G. Flowers, A.-G. Ricketts, E. Yeager, M. Konarski, A. Torres, and L. Crane, "Underfilling fine pitch BGAs," IEEE Trans. Electron. Packag. Manuf., vol. 24, no. 4, pp. 293-299, Oct. 2001.
2. N. Hannan, P. Viswanadham, L. Crane, E. Yaeger, A. Torres, and R. W. Johnson, "Reworkable underfill materials for improved manufacturability and reliability of CSP assemblies," in Proc. APEX Conf., San Diego, CA, Jan. 14-18, 2001, pp. AT8-3-1-AT8-3-10.
3. S. J. Young, "Underfilling BGA and CSP for harsh environment deployment," in Proc. 1999 Int. Conf. High Density Packaging and MCMs, Denver, CO, Apr. 7-9, 1999. [CD ROM].
4. A. C. Shiah, T. Liu, K. Lee Y. S. Chen, and C. S. Wang, "Evaluation of underfill material on board level reliability improvement of wafer level CSP component," in Proc. APEX Technical Program, Anaheim, CA, Feb. 24-26, 2004, pp. S02-1-1-S02-1-14.
5. M. Painaik, S. Kanagavel, and D. L. Santos, "Reliability assessment of CSP underfill methods," in Proc. APEX Technical Program, Anahiem, CA, Feb. 24-26, 2004, pp. S34-2-1-S34-2-6.
6. S. Zhang, C. Chen, S. Yee, and A. C. Shiah, "Enhancement of CSP mechanical strength using underfill or bonding material," in Proc. APEX Technical Program, Anaheim, CA, Mar. 31-Apr. 2 2003, pp. S23-1-1-S23-1-7.
7. S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, "Wetting characteristics of Pb-free solder alloys and PWB finishes," IEEE Trans. Electron. Packag. Manuf., vol. 25, no. 3, pp. 168-184, Jul. 2002.
8. J. Liu, R. W. Johnson, E. Yaeger, M. Konarski, and L. Crane, "CSP underfill, processing and reliability," in Proc. APEX Technical Program, San Diego, CA, Jan. 19-24, 2002, pp. S16-1-1-S16-1-7.
9. G. Tian, Y. Liu, P. Lall, R. W. Johnson, S. Abderrahman, M. Palmer, N. Islam, J. Suhling, and L. Crane, "Corner bonding of CSPs: Processing and reliability," in Proc. 2003 APEX Conf., Anaheim, CA, Mar. 31-Apr. 2 2003, pp. S02-1-1-S02-1-8.
10. T.-C. Chiu, K. Zeng, R. Stierman, D. Edwards, and K. Ano, "Effect of thermal aging on board level drop reliability for Pb-free BGA packages," in Proc. 54th Electronic Components Technology Conf., Las Vegas, NV, Jun. 1-4, 2004, pp. 1256-1262.