Processing and reliability of CSPs with underfill

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 4, 2003, Pages 313-319

  Liu, Jing ^a   Johnson, R Wayne ^a   Yaeger, Erin ^b   Konarski, Mark ^b   Crane, Larry ^b  

^a AUBURN UNIVERSITY   (United States)

^b Loctite Corp   (United States)

Author keywords

Chip scale packages; Drop test; Underfill

Indexed keywords

ASSEMBLY; INTEGRATED CIRCUIT LAYOUT; RELIABILITY; THERMAL CYCLING;

DROP TEST; THERMAL SHOCK; UNDERFILL;

CHIP SCALE PACKAGES;

EID: 1242331331     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.822082     Document Type: Article

References (4)

1. H. Peng, R. W. Johnson, G. Flowers, E. Yeager, M. Konarski, A. Torres, and L. Crane, "Underfilling micro-BGAs," in Proc. Int. Conf. High-Density Interconnect Syst. Packag., Denver, CO, Apr. 25-28, 2000, pp. 134-140.
2. N. Hannan, P. Viswanadham, L. Crane, E. Yaeger, A. Torres, and R. W. Johnson, "Reworkable underfill materials for improved manufacturability and reliability Of CSP assemblies," in Proc. 2001 APEX Conf., San Diego, CA, Jan. 14-18, 2001, pp. AT8-3-1-AT8-3-10.
3. S.J. Young, "Underfilling BGA and CSP for harsh environment deployment," in Proc. 1999 Int. Conf. High Density Packag. MCMs, Denver, CO, Apr. 7-9, 1999.
4. B. Houghton, "Solving the ENIG black pad problem: an ITRI report on round 2," in Proc. IPC Works '99, Minneapolis, MN, Oct. 23-28, 1999, pp. S-04-3-1-S-04-3-9.