Corner bonding of CSPs: Processing and reliability

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 3, 2005, Pages 231-240

  Tian, Guoyun ^a   Liu, Yueli ^a   Johnson, R Wayne ^a   Lall, Pradeep ^a   Palmer, Mike ^a   Islam, Mohd Nokibul ^a   Crane, Lawrence ^b  

^a AUBURN UNIVERSITY   (United States)

^b Henkel Loctite Corp   (United States)

Author keywords

Chip scale package (CSP); Chip scale packaging; Drop testing; Underfill

Indexed keywords

CAPILLARY FLOW; COMPUTATIONAL COMPLEXITY; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

CORNER BONDING; DROP TESTING; UNDERFILL;

CHIP SCALE PACKAGES;

EID: 27844599232     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.852234     Document Type: Article

References (8)

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