Drop reliability performance assessment for PCB assemblies of Chip Scale Packages (CSP)

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 262-269

  Chong, Desmond Y R ^a   Toh, H J ^a   Lim, B K ^a   Low, Patrick T H ^a   Pang, John H L ^b   Che, F X ^b   Xiong, B S ^b   Xu, Luhua ^b  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DROP RELIABILITY; LEAD-BASED SOLDER; ORGANIC SOLDERABILITY; SOLDER BALL COMPOSITIONS;

ELECTROLESS PLATING; IMPACT TESTING; MINIATURE INSTRUMENTS; PRINTED CIRCUIT BOARDS; RELIABILITY THEORY; SOLDERING ALLOYS;

CHIP SCALE PACKAGES;

EID: 33847268739     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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