Bonding quartz wafers by the atom transfer radical polymerization of the glycidyl methacrylate at mild temperature

Sensors and Actuators, A: Physical

Volumn 135, Issue 1, 2007, Pages 257-261

  Zhao, Jianying ^a,b   Shang, Zhenping ^a   Gao, Lianxun ^a  

^a CHANGCHUN INSTITUTE OF APPLIED CHEMISTRY   (China)

^b SHANDONG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

ATRP; Bonding; Chip; Microfluidics

Indexed keywords

AMINO ACIDS; CATALYST ACTIVITY; CHANNEL FLOW; MICROFLUIDICS; POLYMERIZATION; QUARTZ;

AMINOSILYLATION; GLYCIDYL METHACRYLATE; MICROFLUIDIC CHIPS;

WAFER BONDING;

EID: 33947319526     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.06.070     Document Type: Article

References (39)

1. Manz A., Fettinger J.C., Verpoorte E.M.J., Ludi H., Widmer H.M., and Harrison D.J. Micromachining of monocrystalline silicon and glass for chemical analysis systems-a look into next century's technology or just a fashionable craze. Trends Anal. Chem. 10 (1991) 144-149
2. Harrison D.J., Manz A., Fan Z., Luedi H., and Widmer H.M. Capillary electrophoresis and sample injection systems integrated on a planar glass chip. Anal. Chem. 64 (1992) 1926-1932
3. Jacobson S.C., Hergenroder R., Koutny L.B., Warmack R.J., and Ramsey J.M. Effects of injection schemes and column geometry on the performance of microchip electrophoresis devices. Anal. Chem. 66 (1994) 1107-1113
4. Becker H., and Locascio L.E. Polymer microfluidic devices: a review. Talanta 56 (2002) 267-287
5. Reyes D.R., Iossifidis D., Auroux P.A., and Manz A. Micro total analysis systems. 1. Introduction, theory and technology. Anal. Chem. 74 (2002) 2623-2626
6. Schmidt M.A. Wafer-to-wafer bonding for microstructure formation. Proc. IEEE 86 (1998) 1575-1585
7. Maszara W.P. Silicon-on-insulator by wafer binding: a. review. J. Electrochem. Soc. 138 (1991) 341-347
8. Harrison D.J., Fluri K., Seiler K., Fan Z., Effenhauser C.S., and Manz A. Micromachining a miniaturized capillary electrophoresis-based chemical analysis system on a chip. Science 261 (1993) 895-897
9. Harendt C., Appel W., Graf H.G., Hofflinger B., and Penteker E. Wafer fusion bonding and its application to silicon-on-insulator fabrication. J. Micromech. Microeng. 1 (1991) 145-151
10. Lasky J.B. Wafer bonding for silicon-on-insulator technologies. Appl. Phys. Lett. 48 (1986) 78-80
11. Wallis G., and Pomerantz D.I. Field assisted glass-metal sealing. J. Appl. Phys. 40 (1969) 3946-3949
12. Anthony T.R. Dielectric isolation of silicon by anodic bonding. J. Appl. Phys. 58 (1985) 1240-1247
13. Hemmi H., Shoji S., Shoji Y., and Esashi M. Vacuum packaging for microsensors by glass silicon anodic bonding. Sens. Actuators A 43 (1994) 243-248
14. Chung G.S., and Kim J.M. Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications. Sens. Actuators A 116 (2004) 352-356
15. Schjølberg-Henriksen K., Jensen G.U., Hanneborg A., and Jakobsen H. Anodic bonding for monolithically integrated MEMS. Sens. Actuators A 114 (2004) 332-339
16. Wei J., Nai S.M.L., Wong C.K., and Lee L.C. Glass-to-glass anodic bonding process and electrostatic force. Thin Solid Films 462-463 (2004) 487-491
17. Kutchoukov V.G., Laugere F., van der Vlist W., Pakula L., Garini Y., and Bossche A. Fabrication of nanofluidic devices using glass-to-glass anodic bonding. Sens. Actuators A 114 (2004) 521-527
18. Berthold A., Nicola L., Sarro P.M., and Vellekoop M.J. Glass-to-glass anodic bonding with standard IC technology thin film as intermediate layers. Sens. Actuators A 82 (2000) 224-228
19. Ko W.H., and Suminto J.T. Semiconductor integrated circuit technology and micromachining. In: Gopel W., Hasse J., and Zennel J.N. (Eds). Sensors vol. 1 (1989), VCH, Weinhein 107-168
20. Yang C.Y., and Lee C.C. A eutectic bonding technology at a temperature below the eutectic point. IEEE (1992) 502-506
21. Tan A.W.Y., and Tay F.E.H. Sens. Actuators A 120 (2005) 550-561
22. Sayah A., Solignac D., Cueni T., and Gijs M.A.M. Development of novel low temperature bonding technologies for microchip chemical analysis applications. Sens. Actuators A 84 (2000) 103-108
23. 2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS. Sens. Actuators A 79 (2000) 237-244
24. 2 HF bonding and its application for UV detection micro flow cell. Sens. Actuators A 83 (2000) 136-141
25. Chiem N., Lockyear-Shultz L., Andersson P., Skinner C., and Harrison D.J. Room temperature bonding of micromachined glass devices for capillary electrophoresis. Sens. Actuators B 63 (2000) 147-152
26. Smith R.L., and Collins S.D. Micromachined packaging for chemical microsensors. IEEE Trans. Electron Devices ED-35 (1988) 787-792
27. Maszara W.P., Goetz G., Caviglia A., and McKitterick J.B. Bonding of silicon wafers for silicon-on-insulator. J. Appl. Phys. 64 (1988) 4943-4950
28. Lasky J.B. Wafer bonding for silicon-on-insulator technologies. Appl. Phys. Lett. 48 (1986) 78-80
29. Shimbo M., Furukawa K., Fukuda K., and Tanzawa K. Silicon-to-silicon direct bonding method. J. Appl. Phys. 60 (1986) 2987-2989
30. Wallis G., and Pomerantz D.I. Field assisted glass-metal sealing. J. Appl. Phys. 40 (1969) 3946-3949
31. Esashi M. Encapsulated micro mechanical sensors. Microsyst. Technol. 1 (1994) 2-9
32. Ziaie B., Von Arx J.A., Dokmeci M.R., and Najafi K. A hermetic glass-silicon micropackage with high-density on-chip feed throughs for sensors and actuators. J. Microelectromech. Syst. 5 (1996) 166-179
33. Lee Y., and Wise K. A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity. IEEE Trans. Electron Devices ED-29 (1982) 42-48
34. Jia Z.J., Fang Q., and Fang Z.L. Bonding of glass microfluidic chips at room temperatures. Anal. Chem. 76 (2004) 5597-5602
35. Kräuter G., Bluhm Y., Batz-Sohn C., and Gösele U. The joining of parallel plates via organic monolayers: chemical reactions in a spatially confined system. Adv. Mater. 11 (1999) 1035-1038
36. Moon J.H., Shin J.W., Kim S.Y., and Park J.W. Formation of uniform aminosilane thin layers: an imine formation to measure relative surface density of the amine group. Langmuir 12 (1996) 4621-4624
37. Moon J.H., Kim J.H., Kim K.J., Kang T.H., Kim B., Kim C.H., Hahn J.H., and Park J.W. Absolute surface density of the amine group of the aminosilylated thin layers: ultraviolet-visible spectroscopy, second harmonic generation, and synchrotron-radiation photoelectron spectroscopy study. Langmuir 13 (1997) 4305-4310
38. Erdogan M., Hepuzer Y., Cianga I., Yagci Y., and Pekcan O. Diffusion of pyrene end-capped polystyrene prepared via atom transfer radical polymerization into polystyrene gels in the presence of toluene. J. Phys. Chem. A 107 (2003) 8363-8370
39. Liu S., Weaver J.V.M., Save M., and Armes S.P. Synthesis of pH-responsive shell cross-linked micelles and their use as nanoreactors for the preparation of gold nanoparticles. Langmuir 18 (2002) 8350-8357