Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 718-726

  Jen, Yi Ming ^a   Fang, Chih Kai ^b   Yeh, Yun Hsin ^c  

^a CHUNG HUA UNIVERSITY   (Taiwan)

^b Shihlin Electric and Engineering Corporation ^*  (Taiwan)

^c Powertech Technology Inc   (Taiwan)

Author keywords

Finite element (FE) method; Flip chip plastic ball grid array (FC PBGA); Lid substrate adhesive; Reliability; Thermal cycling test; Thermal enhancement; Thermal fatigue life; Viscoplastic

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; RELIABILITY; THERMAL CYCLING; VISCOPLASTICITY;

FLIP CHIP PLASTIC BALL GRID ARRAY (FC-PBGA); LID SUBSTRATE ADHESIVE; SOLDER BALLS; THERMAL CYCLING TESTS; THERMAL ENHANCEMENT; THERMAL FATIGUE LIFE; VISCOPLASTICS;

ELECTRONICS PACKAGING;

EID: 33947266035     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885927     Document Type: Article

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