Mechanisms of die and underfill cracking in flip chip PBGA package

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 201-205

  Shim, Jong Bo ^a   Ahn, Eun Chul ^a   Cho, Tae Je ^a   Moon, Ho Jung ^a   Chung, Tae Gyeoug ^a   Lyu, Ju Hyun ^a   Kwon, Hung Kyu ^a   Kang, Sa Yoon ^a   Oh, Se Yong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CRACK INITIATION; DIES; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; STIFFNESS;

CORNER CRACKING; EDGE CRACKING; POPCORN CRACKING; UNDERFILLS;

ELECTRONICS PACKAGING;

EID: 0033721111     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)